Qualcomm $QCOM rose to $148.85, up $15.01 or about 11.2%, after analyst Ming-Chi Kuo said OpenAI is working with Qualcomm and MediaTek on smartphone processors for a 2028 device. None of the companies confirmed the report, but the move put Qualcomm back at the center of the AI hardware trade.
Intel $INTC rose about 20% after reporting adjusted EPS of $0.29 on $13.58B of Q1 revenue, versus LSEG expectations of $0.01 and $12.42B. Data-center revenue rose 22% and second-quarter guidance also topped the Street.
Texas Instruments $TXN gained 19% after first-quarter revenue rose 19% to $4.83B and EPS reached $1.68, beating LSEG estimates of $4.53B and $1.27. Management said data-center demand surged about 90% year over year and guided the second quarter above consensus.
SK Hynix (000660.KS) reported Q1 revenue of KRW 52.5763T, operating profit of KRW 37.6103T and a 72% operating margin as AI memory demand lifted pricing.
Cerebras filed an S-1 on April 17 for a Nasdaq listing under $CBRS, reporting 2025 revenue of $510.0M, up 76%, and 2025 net income of $237.8M after a $481.6M net loss in 2024. The filing says OpenAI committed to a multi-year deal valued at more than $20B and received a 33.4M-share warrant subject to vesting.
TSMC $TSM reported NT$572.48 billion in first-quarter net income, up 58.3% year over year and above the NT$543.32 billion LSEG SmartEstimate cited by CNBC. The foundry guided second-quarter revenue to $39.0 billion-$40.2 billion as AI demand kept advanced capacity tight.
ASML $ASML gained 1.1% after first-quarter net sales of €8.8 billion and net profit of €2.8 billion beat LSEG expectations of €8.5 billion and €2.5 billion. The company lifted its 2026 sales outlook to €36 billion-€40 billion as AI-related chip demand continued to tighten capacity.
The Hacker News discussion around Qatar’s helium outage focused on a physical bottleneck beneath the AI stack. Tom’s Hardware says the shutdown removes about 30% of global helium supply, while South Korea and Taiwan monitor possible semiconductor impacts.
ASML has announced a breakthrough in EUV light source technology that could produce 50% more semiconductor chips from the same wafer by 2030.